Your cooling expert

From Board-level to Datacenter cooling

As thermal load and packing densities increase, thermal management has become a key consideration for most design engineers. nVent SCHROFF has always had a strong emphasis on the thermal design, and has the equipment, expertise, and experience to assist customers overcome difficult thermal challenges.


Cooling concepts are necessary to avoid thermal overloads and ensure trouble-free operation of the components. To optimize a perfect cooling effect, various factors must be considered, depending on the application and area of use. Learn more about cooling of your electronics, no matter the application.


Impact of Card-Lok Selection on Conduction Modules Thermal Performance


Today’s engineers must have access to key hardware components’ thermal data to make the best data driven design decisions possible. Examples of these hardware components include printed circuit board assemblies, Wedge-Loks and the VITA conduction-cooled assemblies to which they are assembled. This white paper will explore how nVent SCHROFF has approached thermal testing methods at the module level, resulting data, and how this data can be leveraged to make more informed design decisions based on how Card-Lok selection impacts thermal performance.

Design consideration when cooling a small form factor and 19“ embedded systems


As in many other areas, the requirements of the application and the user determine the solution in cooling technology. In the example of cooling solutions for small form factor and 19" systems, criteria such as the performance or power dissipation of the application, the ambient temperature, the required IP protection and EMC protection, the noise level, the reliability, and the desired durability of the systems are fundamental. This white paper will explore the four types of cooling techniques that are typically available for this purpose: free convection, forced convection, conduction cooling, and water/liquid cooling.


Improving data center efficiency and it’s related impacts


The energy consumption required to cooling electronics efficient, is a major challenge. Especially large data centers have invested heavily to optimize power usage, in addition to utilizing alternative and renewable energy sources. However, there are still various mid-size data center installations that can improve their power usage by implementing simple improvements. This white paper will explore which steps must be taken to ensure proper airflow in the data center, while still minimized energy consumption.

Maximizing liquid cooling efficiencies for advanced level rack cooling


Increased heat densities of IT Equipment (ITE) in high performance data centers continues to drive the need for more efficient and effective cooling technologies. Traditional air cooling is not a sustainable solution in these settings. While liquid cooling offers far greater efficiencies than air cooling, many liquid cooling options require large capital expenditures, are difficult to integrate with existing infrastructure, and present complications when upgrades or added capacity are needed. This white paper presents a rack level Hybrid Liquid Cooling System that couples direct-contact liquid cooling with a rear door cooler air-to-water heat exchanger.


Your Cooling Expert

When developing equipment housing electronics, no matter if it is a small form factor case, or a larger datacenter , it is important to focus on the cooling aspect right from the start. As early as the concept phase our experts guide you through the whole set-up with early calculations, simulation and testing.

About nVent schroff

nVent SCHROFF has been synonymous with innovation since it was founded in Germany in 1962, starting with the development of a euro board subrack system that helped make the 19” standard universal. nVent continues to pioneer electronic infrastructure for a wide range of applications today. Download now 

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75334 Straubenhardt, Germany

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Fax: +49 (0) 7082 794 200
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