Increasing packing densities and power capacities mean increased heat generation, which can increase the risk of failure of electronic devices and systems. Sophisticated cooling concepts are necessary to avoid thermal overloads and thus ensure trouble-free operation of the equipment. For optimal cooling, various factors must be taken into account, depending on the application and area of use.
How a suitable cooling solution looks like is determined by several criteria. A very important criterion is the maximum permitted component temperature, which is defined by the level of power consumption, and the general conditions at the installation site must also be taken into account. Essentially, there are four types of cooling solutions that come into question for small enclosures and modular 19″ systems, depending on the power dissipation.
