nVent SCHROFF

New challenges for test and measurement systems

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TESTING THE CARD-LOK IMPACT ON OVERALL MODULE PERFORMANCE

What you need to consider

Today’s engineers must have access to key hardware components’ thermal data to make the best data driven design decisions possible. Examples of these hardware components include printed circuit board assemblies, Wedge-Loks and the VITA conduction-cooled assemblies to which they are assembled. This white paper will explore how nVent SCHROFF has approached thermal testing methods at the module level, resulting data, and how this data can be leveraged to make more informed design decisions based on how Card-Lok selection impacts thermal performance.

Positioning the cooling device closer to the heat source will improve your cooling efficiency

What is important

This white paper explores thermal testing methods at the module level, resulting data, and how this data can be leveraged to make more informed design decisions based on how Card-Lok selection impacts thermal performance.

Thermal testing methodology and fixtures
Impact of Card-Loks on overall thermal performance on VITA conduction cooled module configurations including VITA 48.2 and VITA 46
Card-Lok thermal resistance
New high thermal conduction cooled modules and Card-Lok design