nVent offers different solutions depending on the cooling requirements of the embedded system application and its environment.
Active Cooling through fans can be integrated into the case, with several options for fan location, to optimize cooling.
Conduction Cooling is achieved through an integrated heat sink, available in different heights and locations on the top of the case. Additionally, Schroff‘s patented Flexible Heat Conductor (FHC) offers industry leading cooling performance.
The FHC utilizes the conductivity of an aluminum block, but with internal springs, allowing it to expand and contract vertically. The innovative design compensates for tolerances along the thermal path, eliminating the need for a thick gap pad, and therefore optimizing thermal transfer. Together, the FHC and nVent range of conduction cooled Schroff Interscale cases can provide industry leading conduction cooling performance and reliability over the lifetime of the system.