Standards like COM Express exist for making customer-specific small form factor solutions. These are used to reduce the user's development time and costs. Is it possible to reduce the user's development costs even further? This white paper describes how this can be done with a modular approach to the carrier, enclosure and cooling using pre-qualified components.

It focuses specifically on the implementation and qualification of high-speed data interfaces and optimization of cooling through simulation and thermal measurement.

This whitepaper will give you insights about:

• Integration and functionality of the COM carrier
• Signal integrity in COM carrier design
• Cooling design development for the new Schroff COM carrier system